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1) We are considering
buying Military grade devices and up-screening them to a JANS quality level.
Does Micropac provide up-screening services?
Micropac
can provide levels of up-screening services, either directly or indirectly
through partners in industry; however, an up-screened device will not necessarily
meet all of the requirements of a space-level counterpart. Micropac recommends
using JANS or Class K quality levels for space applications as the best policy.
2)
Are any of your military products RoHS compliant?
Most
Micropac products are RoHS compliant in their standard form. Those that are not
can be made RoHS compliant by special order.
3) What about tin
whiskers on High-Rel devices?
Micropac
does not utilize pure tin in any of its designs.
4) Micropac is a new
vendor; whom do I send our survey to?
It is not necessary to send us a survey. We have a standard vendor information form that may be applied to all quality systems. Please contact Micropac Quality Assurance in order to receive the Micropac Vendor Survey Information.
5) I have heard that
Micropac makes replacements for some very old device designs, like the Glass
Stick detector.
Many
factors affect the capability to develop replacement devices, but Micropacs
engineering staff has the expertise to re-create the device where component
availability is feasible, or design a device that is form, fit, and functionally
identical.
6) I know Micropac makes
custom parts, but I need a device exactly like the one I have now, with better
reliability.
Micropac
is a demonstrated leader in providing copy exact devices, along with
enhanced reliability requirements. Contact our Sales department with your
requirements.
7) I want to perform pre-cap source inspection, but how can we see anything when optical coatings are
used, such as in optocouplers.
Micropac
actually recommends that pre-cap be performed as a post-bond inspection.
Inspecting before coatings are applied allows inspection of the die and wires,
along with the advantage that bond pull / ball shear can be performed without
the degrading effects of de-gelling the devices.
8) I used our usual
solvent to de-gel some parts for DPA, and the die have come off the header!
As
Micropac generally uses conductive epoxy for the die mount process, many
solvents commonly used to remove potting and die coatings are too aggressive and
can attack and dissolve the epoxy. Aggressive
solvents are also known to degrade the attachment of gold and aluminum ball bonds, which can result in erroneous pull readings. Call for the procedure, technical data and the MSDS, on Dynasolve 225.(972) 272-3571.