Micropac Industries, Inc. provides and has provided custom microelectronics packaging services since the early 1960's.  Small Signal and Power Module (Hybrids/Multi Chip Modules) designs along with custom single chip packaging are included in the capabilities offered. Standard off-the-shelf products are also offered by Micropac.

In the case of modules/hybrids, the Company typically provides the packaging expertise for Build To Print/Build to Schematic opportunities. Military-Aerospace, Space and Hi Rel Industrial markets are served. The Hi Rel Industrial applications include High Temperature Oil Exploration and Medical Electronics. The facilities are qualified to MIL-PRF-38534 Class H (Military) and Class K (Space) and are ISO 9001 registered. The Company is also qualified to MIL-PRF-19500 JAN S, MIL-PRF-28750 and MIL D 87157.

Designs include bare die as well as surface mount components utilizing a wide variety of circuit platforms, including:

	Thick Film-Direct Bond Copper, Thin Film, Co-Fired, PC Boards and Flex Circuits. Hermetic and Non-hermetic packaging methods can be provided.
	Micropac Industries, Inc. can help the circuit designer achieve size, space and weight reduction by utilizing the packaging methods available. Component and substrate attach methods include epoxies and solders. Thermal design considerations are also addressed by Micropac engineering.

Micropac Industries, Inc. operates as two autonomous divisions,  Microcircuits Division and Optoelectronics Division, which both offer custom packaging capabilities, including custom hybrids and power hybrids.