Build To Print Hybridization, Miniaturization and Custom Packaging applications comprise the majority of the work done by Micropac. Micropac will work from the customer's SCD that contains the schematic/BOM along with the definition of the electrical test requirements and any screening requirements (burn-in constant acceleration, etc.) as a minimum.  Micropac can determine the appropriate size and package or will "design" to fit in the closest approximation to the customer's package / footprint requirements. The "hybrid" layout would be done by Micropac and Preliminary Design Reviews and Critical Design Reviews would be held with the customer prior to any actual fabrication of the modules.

Micropac can offer a wide range of packaging methods, both hermetic and non hermetic. In most cases the design will include the use of bare die with wire bonds for the interconnect, but surface mount packaged devices attached to a ceramic substrate or other platforms are available. Chip on Board, Chip on Flex and a variety of different metalizations (Thick Film, Thin Film, Direct Bond Copper, etc.) on ceramic (Alumina, BeO, Aluminum Nitride, etc.) can be obtained from Micropac.

Micropac will offer suggestions on mechanical and electrical design whenever possible. Inputs on attachment mediums to use, interconnect methods, packaging options, thermal design considerations, circuit-partitioning etc. are some of the points typically addressed by Micropac.

In general, miniaturization of specific circuit designs is what is achieved by using the packaging techniques offered by Micropac. The degree of miniaturization is dependent on various factors associated with each design.

Micropac Industries, Inc. has provided custom "Build To Print" Multi Chip Modules for almost 40 years.